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1-0224 (technical revision)
The purpose of this Specification is to promote commonality among implementations by defining common representations and conventions of equipment metadata based on SEMI E125 Specification for Equipment Self-Description
including overall equipment efficiency (OEE)
and roundness
orgで入手可能となる。初版は1998年発行。前版は2004年11月発行。
Semiconductor Manufacturing I ElnTpc-Business 1-0224 (technical revision)Course Description Semiconductor manufacturing is a complex process involving many steps. This course covers two crucial steps in the manufacturing process: silicon wafer fabrication and semiconductor deposition. The silicon wafer fabrication step encompasses single crystal growth, wafer grinding, wafer slicing, wafer edge grinding, wafer lapping, wafer etching, and wafer polishing. The semiconductor deposition step includes various important types of